• All substrate must be structurally sound, dry and free from laitance and loose particles.
• Clean floors of oil, grease and rubber skid marks, paint stains and other adhesion impairing contaminants.
• Mechanical surface profiling by grit or shot blasting, grinding or scarifying are the preferred floor preparation methods.
• The residual moisture content of the substrate must not exceed 4%. A damp-proof course must have been properly installed and intact.
• Substrate temperatures: 15°C -35°C, Material temperatures: 15°C -30°C
• Very low or very hot temperatures will make application more difficult and careful consideration should be given to storage of materials.
• In the cold weather conditions, pre- condition materials by keeping it in a heated room. In hot weather conditions, some form of air-conditioned storage is required.
• Pre-conditioned materials at 20-25°C will reduce the possibilities of flash/slow setting and other defects.